InPlay Inc, a provider of wireless connectivity SoC technology, has announced collaboration with NXP Semiconductors, a provider of secure connectivity solutions for embedded applications. This collaboration aim at development of connected sensors. The collaboration leverages InPlay’s NanoBeacon IN100 SoC and NXP’s ultra-low power 3-axis accelerometres, magnetic switch and pressure sensors to offer customers easy-to-use solution.
The In100 SoC is a bluetooth low energy (BLE) beacon solution that is built on InPlay’s proprietary ultra-low-power SoC design platform using Bluetooth Low Energy 5.3 technology. It is no-code Bluetooth Low Energy beacon solution and eliminates the need for software programming. With a provided configuration tool, developers can easily configure the device for various operational modes based on their application needs without any code.
NXP has a rich history of supplying sensors for automotive, industrial IoT, and medical markets. NXP’s sensors, including ultra-low power 3-axis accelerometres FXLS8974CF and FXLS896xAF for motion wake-up applications, magnetic switch NMH1000 and absolute pressure sensors MPL3115A2S and FXPQ3115BVS, are enabling transformation across a range of industrial IoT and medical applications. Integrating sensing technologies from NXP with IN100 will enable ecosystem for connected sensors platforms, allowing customers to expand addressable markets and explore new use-cases. Customers can gain additional value by combining TPMS (NTM88) product with IN100 for automotive applications.
The combination of the IN100 SoC and NXP’s sensors provides a highly optimised and flexible solution that is designed to meet the demanding performance and power requirements. This solution makes it easier for developers to develop connected sensors for a wide range of applications, including industrial IoT, automotive, and consumer electronics.
“We are thrilled to be collaborating with NXP,” says Jason Wu, co-founder, and CEO of InPlay Inc. “This collaboration will allow us to bring our no-code technology to a wider audience, making the development of connected sensors easier and more accessible than ever before.”
“NXP is always looking for ways to enhance our customers’ experience and help them stay ahead of the curve with the latest in sensor technology,” says Dave Monk, vice president and general manager of motion sensor product line at NXP Semiconductors. “NXP knows what it takes to build connectivity solutions that enable next generation use cases and our collaboration with InPlay will enable our customers to explore new use cases and applications in a wider range of vertical markets where power and remote connectivity are crucial to success. Now almost any NXP sensor can be a smart connected sensor, with minimal effort from the developer, helping to expand the reach of the IoT.”
This collaboration between InPlay and NXP is for development of connected sensor technology. With InPlay’s no-code Bluetooth Low Energy SoC solutions and NXP’s skilled in sensors and system solutions, customers can expect a complete ecosystem that is designed to meet their needs and simplify the development process.
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